Method of manufacturing a semiconductor device having a channel layer, a first semiconductor layer and a second semiconductor layer with a conductive impurity region

ABSTRACT

A semiconductor device which is capable of operating with a single positive power supply and has a low gate resistance, and a process for production thereof. 
     The semiconductor device includes a channel layer (which constitutes a current channel), a first semiconductor layer formed on said channel layer, a second semiconductor layer in an island-like shape doped with a conductive impurity and formed on said first semiconductor layer, and a gate electrode formed on said second semiconductor layer, wherein said first and second semiconductor layers under said gate electrode have a conductive impurity region formed therein to control the threshold value of current flowing through said channel layer, and the conductive impurity region formed in second semiconductor layer is doped with a conductive impurity more heavily than in the conductive impurity region formed in said first semiconductor layer.

The present application is a divisional of U.S. application Ser. No.10/194,554, filed Jul. 12, 2002 now U.S. Pat. No. 6,853,018, whichclaims priority to Japanese Patent Application No. JP2001-220532, filedJul. 19, 2001. The present application claims priority to thispreviously filed application. The subject matter of application Ser. No.10/194,554 is incorporated herein by reference.

BACKGROUND OF THE INVENTION

The present invention relates to a semiconductor device such as highelectron mobility transistor and a process for production thereof. Thissemiconductor device has more than one semiconductor layer of laminatestructure therein that permit high speed charge transit.

The recent mobile communication system requires its terminals, such asportable telephones, to have smaller size and less power consumptionthan before. The same requirement as above is imposed also on devices(such as transistors) constituting each terminal. For example, the poweramplifier for digital cellular phones supporting the present-day mobilecommunication is required to operate efficiently at a low voltage with asingle positive power supply.

Among devices in practical use as a power amplifier are the highelectron mobility transistor (HEMT) and the pseudomorphic HEMT (PHEMT).The latter is characterized by its epitaxial structure with someintentional lattice mismatches for much higher electron mobility. Theyare designed to perform current modulation by using the heterojunctionstructure.

The above-mentioned PHEMT has a structure as shown in section in FIG. 4.It is composed of a semi-insulating substrate 31 of single crystal GaAs,a buffer layer 32 of GaAs not doped with impurity, a first barrier layer33 of AlGaAs, a channel layer 34 of InGaAs, and a second barrier layer35 of AlGaAs, which are formed on top of the other. The barrier layer 33is composed of a carrier supply layer 33a containing an impurity of afirst conduction type (e.g., n-type) and high-resistance layers 33 b and33 c. Similarly, the barrier layer 35 is composed of a carrier supplylayer 35a and high-resistance layers 35 b and 35 c.

On the second barrier layer 35 are arranged an n-type GaAs layer 36containing an n-type impurity and an insulting layer 37.

Openings forms in the insulating film 37. A source electrode 39 a and adrain electrode 39 b form in each of the openings, with an n-type GaAslayer 36 placed thereunder. A gate electrode 38 forms in another openingin the insulating film 37. This structure permits the current flowingfrom the source electrode 39 a to the drain electrode 39 b to change inresponse to the voltage applied to the gate electrode 38.

The above-mentioned PHEMT usually has the recessed structure in whichthe second barrier layer 35 is made thin under the gate electrode. Inthis case, the channel layer just below it has a region in whichcarriers are depleted or there are less carriers than in the channellayer of other structure.

The thus structured PHEMT is characterized by its ability to accumulatecarriers in the channel layer 34 upon application of positive voltage tothe gate electrode 38. In principle, it is superior to MES-FET (MetalSemiconductor FET) in linearity of mutual conductance (Gm) versus gatevoltage (Vg). This feature is greatly advantageous to improvement inefficiency of power amplifiers.

One of the transistors capable of operating with a single positive powersupply is the junction field effect transistor (JFET) in which thesemiconductor just below the gate electrode is doped with an impurity ofa second conduction type (say, p-type) such that the built-in potential(φbi) increases between the semiconductor of a first conduction typeforming the channel layer and the semiconductor of a second conductiontype just below the gate electrode.

Doping with an impurity of a second conduction type is not an only wayof increasing the built-in potential. The same object is achieved byforming the layer just below the gate electrode from a semiconductorhaving a larger bandgap than that used for the channel layer. The PHEMTshown in FIG. 4 is based on this technology.

The combination of the advantages of JFET and PHEMT gives a junctionPHEMT (JPHEMT), whose structure is shown in FIG. 5.

The JPHEMT shown in FIG. 5 includes a substrate 41 of semi-insulatingsingle-crystal GaAs, a buffer layer 42 of undoped GaAs, a first barrierlayer 43 of AlGaAs, a channel layer 44 of InGaAs, and a second barrierlayer 45 of AlGaAs, which are sequentially arranged on top of the other.

The barrier layer 43 includes a carrier supply layer 43 a containing animpurity of a first conduction type (n-type) and high-resistance layers43 b and 43 c. Similarly, the barrier layer 45 includes a carrier supplylayer 45 a and high-resistance layers 45 b and 45 c.

On the second barrier layer 45 is arranged an insulating film 47 havingopenings. Two of these openings form a source electrode 49 a and a drainelectrode 49 b. Another opening in the insulating film 47 forms a gateelectrode 48. A gate impurity region 50 forms in the second barrierlayer 45 just below the gate electrode 48. The gate impurity region 50is an impurity (Zn) of a second conduction type (p-type). The abovementioned JPHEMT also has a structure that permits the current flowingfrom the source electrode 49 a to the drain electrode 49 b to change inresponse to the voltage applied to the gate electrode 48.

The JPHEMT constructed as mentioned above is characterized in that thesmaller is the distance (d) between the gate impurity region 50 and thechannel layer 44, the greater is the built-in potential (φbi) betweenthe semiconductor constituting the channel layer 44 and the gateimpurity region 50 just below the gate electrode. This allows the JPHEMTto operate only with a single positive power supply.

Unfortunately, the JPHEMT shown in FIG. 5 has a drawback as follows. Inthe case where the second barrier layer 45 is formed from AlGaAs and theregion just below the gate electrode is doped with an impurity (Zn) of asecond conduction type (p-type) by vapor phase diffusion, Zn diffusesrapidly in the AlGaAs layer on account of its large diffusioncoefficient. Therefore, even though the amount of Zn is small, diffusiontakes place such that the bottom of the Zn diffusion region extends tothe depth, witch is a distance (d), away from the channel layer 44. Theresult is that the impurity (Zn) of a second conduction type in theuppermost layer of the second barrier layer 45 forms from AlGaAs has aconcentration which is about one half that in the case where the secondbarrier layer 45 is formed from GaAs. This low concentration leads to apoor ohmic contact, which in turn results in a high gate resistanceunfavorable to the gain of power amplifiers.

As mentioned above, for the JPHEMT to have a large value of φbi and tooperate with a single positive power supply, it is necessary to form thesecond barrier layer 45 from a semiconductor (such as AlGaAs) having alarge bandgap. In addition, for the gate electrode to have a good ohmiccontact, it is necessary to increase the concentration of the impurityof a second conduction type in the outermost surface of the secondbarrier layer 45.

SUMMARY OF THE INVENTION

It is an object of the present invention to provide a semiconductordevice which is capable of operating with a single positive power supplyand has a low gate resistance. It is another object of the presentinvention to provide a process for producing the semiconductor device.

According to an aspect of the present invention, a semiconductor deviceincludes a channel layer, a first semiconductor layer formed on thechannel layer, a second semiconductor layer in an island-like shapedoped with a conductive impurity and formed on the first semiconductorlayer, and a gate electrode formed on the second semiconductor layer.The first and second semiconductor layers under the gate electrode havea conductive impurity region formed therein to control the thresholdvalue of current flowing through the channel layer, and the conductiveimpurity region formed in second semiconductor layer is doped with aconductive impurity more heavily than in the conductive impurity regionformed in the first semiconductor layer.

The semiconductor device defined above may include the firstsemiconductor layer which is formed from a semiconductor material havinga larger bandgap than that from which the channel layer is formed.

The semiconductor device defined above may include that the firstsemiconductor layer has a carrier supply layer which contains animpurity of a first conduction type and supplies charges to the channellayer, and the conductive impurity region of a second conduction type isformed in the first and second semiconductor layers between the carriersupply layer and the gate electrode.

The semiconductor device defined above may include that the channellayer that is formed from InGaAs and the first semiconductor layer thatis formed from AlGaAs.

Preferably, the semiconductor device defined above further has a sourceelectrode and a drain electrode which are formed on the firstsemiconductor layer and are separated from each other with the gateelectrode in between.

The semiconductor device defined above may further have a thirdsemiconductor layer which is formed under the channel layer and isformed from a semiconductor material having a larger bandgap than thatfrom which the channel layer.

In this semiconductor device, the third semiconductor layer may have acarrier supply layer which contains an impurity of a first conductiontype and supplies charges to the channel layer.

The above-mentioned semiconductor device according to an aspect of thepresent invention produces the following effects.

(i) Since the first and second semiconductor layers under the gateelectrode have the conductive impurity region to control the thresholdvalue of current flowing through the channel layer, the threshold valueof current flowing through the channel layer varies depending on thedistance between the conductive impurity region and the channel layer.

(ii) Since the conductive impurity region formed in the secondsemiconductor layer is doped with a conductive impurity more heavilythan the conductive impurity region formed in the first semiconductorlayer, the contact resistance of the gate electrode is effectivelyreduced.

According to an aspect the present invention, a process for producing asemiconductor device includes a step of forming a channel layer, a stepof forming a first semiconductor layer on the channel layer, a step offorming a second semiconductor layer containing an impurity of a firstconduction type on the first semiconductor layer, a step of forming amasking layer having an opening which causes the second semiconductorlayer to be partly exposed, a step of introducing an impurity of asecond conduction type into the second and first semiconductor layers byusing the masking layer as the mask, and a step of forming a gateelectrode on at least that part of the second semiconductor layer whichis exposed in the opening.

Preferably, the process defined above further includes the step offorming the second semiconductor layer that is accomplished by epitaxialgrowth which introduces the first conductive impurity.

Preferably, the process defined above further includes the step ofintroducing an impurity of a second conduction type into the second andfirst semiconductor layers, which step is accomplished by vapor phasediffusion or ion implantation.

Preferably, the process defined above further includes the impurity of afirst conduction type and the impurity of a second conduction type areof the same kind.

The process defined above further includes both the impurity of a firstconduction type and the impurity of a second conduction type containingZn.

Preferably, the process defined above further includes a step of forminga stopper layer which differs in etching selective ratio from the secondsemiconductor layer, the step being carried out after the step offorming the first semiconductor layer and before the step of forming thesecond semiconductor layer, and the second semiconductor layer beingformed on the stopper layer in the step of forming the secondsemiconductor layer.

Preferably, the process defined above further includes the step offorming the gate electrode, which is followed by a step of performingetching, by using the gate electrode as the mask, on the masking layerand the second semiconductor layer to such an extent that the stopperlayer is exposed, while leaving unetched that part of the masking layerand the semiconductor layer which is under the gate electrode.

Preferably, the process defined above further includes the step ofremoving the masking layer and the second semiconductor layer byetching, which step is followed by a step of forming a source electrodeand a drain electrode which are separated from each other on the stopperlayer with the gate electrode in between.

Preferably, the process defined above further includes the channel layerthat is formed from InGaAs and the first semiconductor layer that isformed from AlGaAs.

According to an aspect of the present invention, the process forproducing a semiconductor device includes to form a first semiconductorlayer on a channel layer, a second semiconductor layer containing animpurity of a first conduction type on the first semiconductor layer, amasking layer having an opening which causes part of the secondsemiconductor layer to be exposed, introducing an impurity of a secondconduction type into the second and first semiconductor layers by usingthe masking layer as the mask, and a gate electrode on at least thatpart of the second semiconductor layer which is exposed in the opening.

Moreover, according to an aspect of the above-mentioned process, thesecond semiconductor layer is formed by epitaxial growth with animpurity of a first conduction type. In this way it is possible tointroduce into the second semiconductor layer an impurity of a firstconduction type in a concentration sufficient to reduce the contactresistance of the gate electrode.

Subsequently, an impurity of a second conduction type is introduced intothe second and first semiconductor layers by vapor phase diffusion orion implantation. In this way it is possible to introduce an impurity ofa second conduction type into a desired depth and regulating this depthpermits the threshold value of current flowing through the channel layerto be controlled.

BRIEF DESCRIPTION OF THE DRAWINGS

These and other objects of the invention will be seen by reference tothe description, taken in connection with the accompanying drawing, inwhich;

FIG. 1 is a sectional view showing the structure of a semiconductordevice pertaining to one embodiment of the present invention;

FIGS. 2A to 2C are sectional views showing the step of forming a carriersupply layer for a first barrier layer according to a method ofproducing a semiconductor device;

FIGS. 2D to 2F are sectional views showing the step of forming ahigh-resistance layer for a second barrier layer, subsequent to the stepof shown in FIGS. 2A to 2C, of producing a semiconductor device;

FIGS. 2G and 2H are sectional views showing the step of forming thesecond barrier layer, subsequent to the step of shown in FIGS. 2D to 2F,of producing a semiconductor device;

FIGS. 2I and 2J are sectional views showing the step of forming a layerfor high-concentration gate impurity, subsequent to the step of shown inFIGS. 2G and 2H, of producing a semiconductor device;

FIGS. 2K and 2L are sectional views showing the step of forming a gateimpurity region, subsequent to the step of shown in FIGS. 2I and 2J, ofproducing a semiconductor device;

FIG. 2M and 2N are sectional views showing the step of forming a gate,subsequent to the step of shown in FIGS. 2K and 2L, of producing asemiconductor device;

FIG. 2O and 2P are sectional views showing the step of forming ainsulating film, subsequent to the step of shown in FIGS. 2M and 2N, ofproducing a semiconductor device;

FIG. 3 is a sectional view showing the structure of a semiconductordevice pertaining to another embodiment of the present invention;

FIG. 4 is a sectional view showing the structure of a conventionalPHEMT; and

FIG. 5 is a sectional view showing the structure of a conventionalJPHEMT.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

FIG. 1 is a sectional view showing the structure of the semiconductordevice pertaining to one embodiment of the present invention.

The semiconductor device shown in FIG. 1 includes a substrate 11 ofhalf-insulating single-crystal GaAs, a buffer layer 12 of undoped GaAs,a first barrier layer 13 of III–V compound semiconductor, a channellayer 14, and a second barrier layer 15, which are sequentially arrangedon top of the other.

The second barrier layer 15 has an etching stopper layer 16 (mentionedlater) formed thereon by deposition to a desired thickness (say, about 5nm). A high-concentration gate impurity layer 17 forms on part of thestopper layer 16 by deposition in an island-like shape.

An insulation film 18 forms on the high-concentration gate impuritylayer 17 by deposition to a desired thickness, say about 300 nm. Theinsulating film 18 has an opening 18 a. A gate electrode 21 forms on theinsulating film 18 through the opening 18 a.

The stopper layer 16 and the gate electrode 21 are covered with aninsulating film 19 by deposition to a desired thickness, say about 300nm. The insulating film 19 (on the stopper layer 16) has two openings 19a and 19 b a certain distance apart. In these openings 19 a and 19 b areformed a source electrode 22 a and a drain electrode 22 b, respectively.

A gate impurity region 20 (doped with an impurity of a second conductiontype) is so formed as to penetrate the high-concentration impurity layer17 (under the gate electrode 21), the stopper layer 16, and the secondbarrier layer 15. The gate impurity region 20 is doped with a p-typeimpurity (Zn) by gas phase diffusion.

More detailed mention is made below of individual layers.

The barrier layers 13 and 15 are formed from a semiconductor having abroader bandgap than the semiconductor forming the channel layer 14.Such a semiconductor should preferably be Al_(x)Ga_(1-x)As (mixedcrystal), with x=0.2 to 0.3.

Basically, the barrier layers 13 and 15 are high-resistance layerscontaining no impurities; however, they have carrier supply layers 13 aand 15 a, respectively, which contain an n-type impurity in highconcentration. Each of the carrier supply layers 13 a and 15 a is acertain distance (say, about 2 to 4 nm) away from the channel layer 14.

Each of the carrier supply layers 13 a and 15 a has a prescribedthickness (say, about 4 nm) and is doped with an n-type impurity (Si) ina prescribed dose (say, 1.0×10¹² to 2.0×10¹²/cm²). Each of the undopedhigh-resistance layers 13 b and 15 b (between each of the carrier supplylayers 13 a and 15 a and the channel layer 14) has a thickness (say,about 2 nm) which is smaller than that of the carrier supply layers 13 aand 15 a.

The channel 14 functions as a current passage between the sourceelectrode 22 a and the drain electrode 22 b. The channel 14 is formedfrom a semiconductor having a narrower bandgap than the semiconductorforming the barrier layers 13 and 15.

Such a semiconductor should preferably be undoped InGaAs (mixedcrystal), specifically In_(x)Ga_(1-x)As, where x=0.1 to 0.2. Thus, thechannel layer 14 accumulates carriers supplied from the carrier supplylayer 13 a of the first barrier layer 13 and the carrier supply layer 15a of the second barrier layer 15.

The stopper layer 16 stops etching when the high-concentration gateimpurity layer 17 undergoes selective etching. In the case where AlGaAsforms the high-concentration gate impurity layer 17, GaAs or AlGaAs thatdiffers in composition from the high-concentration gate impurity layer17 should form the stopper layer 16. Moreover, in the case where GaAsforms the high-concentration gate impurity layer 17, Al_(x)Ga_(1-x)As,where x=0.5 should preferably forms the stopper layer 16.

The high-concentration gate impurity layer 17 is formed from asemiconductor having a narrower bandgap than the semiconductor formingthe channel 14. A preferred example of such a semiconductor isAl_(x)Ga_(1-x)As, where x=0.2 to 0.3. Alternatively, thehigh-concentration gate impurity layer 17 is doped with a p-typeimpurity (say, Zn) in a prescribed dose (say, about 2×10¹⁹/cm²)

The gate electrode 21 has a laminate structure composed of titanium(Ti), platinum (Pt), and gold (Au), which are placed on top of theother, with Ti close to the substrate.

Each of the source electrode 22 a and the drain electrode 22 b has alaminate structure composed of gold-germanium (AuGe), nickel (Ni), andgold (Au), which are placed on top of the other, with AuGe close to thesubstrate. They are in ohmic contact with the barrier layer 15 throughthe stopper layer 16.

The semiconductor device pertaining to one embodiment of the presentinvention is produced by the process explained in the following withreference to FIGS. 2A to 2P.

In the first step shown in FIG. 2A, a substrate 11 of half-insulatingsingle-crystal GaAs undergoes MOCVD (Metal Organic Chemical VaporDeposition) for epitaxial growth of a buffer layer 12, which is composedof undoped GaAs and has a prescribed thickness, say 3 to 5 μm.

In the next step shown in FIG. 2B, the buffer layer 12 undergoes MOCVDfor epitaxial growth of a high-resistance layer 13 c, which is composedof undoped AlGaAs and has a prescribed thickness, say about 200 nm.

In the next step shown in FIG. 2C, the high-resistance layer 13 cundergoes MOCVD for epitaxial growth of a carrier supply layer 13 a,which is composed of n-type AlGaAs doped with silicon (as an n-typeimpurity) and has a prescribed thickness, say about 4 nm.

In the next step shown in FIG. 2D, the carrier layer 13 a undergoesMOCVD for epitaxial growth of a high-resistance layer 13 b, which iscomposed of undoped AlGaAs and has a prescribed thickness of about 2 nm.Thus there is formed a first barrier layer 13 including thehigh-resistance layer 13 c, the carrier supply layer 13 a, and thehigh-resistance layer 13 b.

In the next step shown in FIG. 2E, the first barrier layer 13 undergoesMOCVD for epitaxial growth of a channel layer 14, which is composed ofundoped InGaAs and has a prescribed thickness, say about 10 nm.

In the next step shown in FIG. 2F, the channel layer 14 undergoes MOCVDfor epitaxial growth of a high-resistance layer 15 b, which is composedof undoped AlGaAs and has a prescribed thickness, say about 2 nm.

In the next step shown in FIG. 2G, the high-resistance layer 15 bundergoes MOCVD for epitaxial growth of a carrier supply layer 15 a,which is composed of n-type AlGaAs doped with silicon (as an n-typeimpurity) and has a prescribed thickness, say about 4 nm.

In the next step shown in FIG. 2H, the carrier layer 15 a undergoesMOCVD for epitaxial growth of a high-resistance layer 15 c, which iscomposed of undoped AlGaAs and has a prescribed thickness, say about 130nm. Thus there is formed a second barrier layer 15 including thehigh-resistance layer 15 c, the carrier supply layer 15 a, and thehigh-resistance layer 15 b.

In the next step shown in FIG. 2I, the second barrier layer 15 undergoesMOCVD for epitaxial growth of a stopper layer 16, which is composed ofGaAs and has a prescribed thickness, say about 130 nm.

In the next step shown in FIG. 2J, the stopper layer 16 undergoes MOCVDfor epitaxial growth of a high-concentration gate impurity layer 170,which is composed of p-type AlGaAs heavily doped with Zn in a prescribeddose, say equal to or more than 2×10¹⁹/cm³.

The epitaxial layer except for the regions in which transistors areformed is removed by mesa-etching for element isolation.

In the next step shown in FIG. 2K, the high-concentration gate impuritylayer 170 undergoes CVD (Chemical Vapor Deposition) with silicon nitride(SiN) so as to form an insulating film (masking layer) 180. Then,etching is performed through a resist mask with a prescribed pattern, soas to form an opening 18 a in the insulating film 180. This opening isused to form the gate impurity region.

In the next step shown in FIG. 2L, a gate impurity region 20 is formedin the high-concentration gate impurity layer 170, the stopper layer 16,and the barrier layer 15, by vapor phase diffusion with zinc (zn) as ap-type impurity through the opening 18 a in the insulating film 180.This vapor phase diffusion employs the insulating film 180 as the mask.

Ion implantation may carry out the doping of a p-type impurity; however,in this case it is necessary to activate the doped impurity by hightemperature heating. Therefore, vapor-phase dispersion is preferable.The depth of diffusion is controlled by regulating the duration of vaporphase diffusion.

In the next step shown in FIG. 2M, the entire surface (including theopening 18 a) of the insulating film 180 undergoes vacuum evaporation tosequentially form Ti layer (100 nm thick), Pt layer (50 nm thick), andAu layer (220 nm thick). These layers constitute the gate metal. Thegate metal (except for the part constituting the gate electrode)undergoes sputter etching through a mask having a prescribed pattern.Thus there is formed the gate electrode 21.

The thus formed gate electrode 21 is in contact with thehigh-concentration gate impurity layer 170. Therefore, good ohmiccontact is established between metal and semiconductor at the transistorgate.

In the next step shown in FIG. 2N, the insulating layer 180 (except forthe part under the gate electrode) undergoes etching so as to form aninsulating film 18. This etching is carried out to such an extent thatthe high-concentration gate impurity layer 170 of AlGaAs doped with ap-type impurity is exposed.

In the next step shown in FIG. 2O, the high-concentration gate impuritylayer 170 undergoes etching by using the gate electrode 21 and theinsulating film 18 as a mask, to such an extent that the stopper layer16 is exposed. Thus, there is formed the high-concentration gateimpurity-layer 17 in an island-like shape.

In the next step shown in FIG. 2P, the gate electrode 21 and the stopperlayer 16 are entirely covered with an insulating film 19 that is formedby CVD from silicon nitride (SiN). The insulating film 19 undergoesselective etching through a resist mask, so as to form openings 19 a and19 b respectively in the source electrode region and the drain electroderegion.

Subsequently, the entire surface (including the openings 19 a and 19 b)of the insulating film 19 undergoes vacuum evaporation repeatedly withgold-germanium alloy (AuGe), nickel (Ni), and gold (Au). The resultinglayers are patterned and undergoes heat treatment for alloying at about400° C. Thus there are formed the source electrode 22 a and the drainelectrode 22 b. In this way it is possible to produce the semiconductordevice shown in FIG. 1.

According to the above-mentioned embodiment, the semiconductor deviceand the process for production thereof are characterized in that thehigh-concentration gate impurity layer 17 just below the gate electrode21 is previously prepared in the stage of forming the substrate. Thisoffers the advantage that a better ohmic contact is established betweenthe gate electrode 21 and the high-concentration gate impurity layer 17than in the case where an undoped barrier layer 15 is doped with ap-type impurity by vapor phase dispersion and the gate electrode isformed thereon afterward. The good ohmic contact contributes to thecharacteristic properties of the semiconductor device intended for poweramplifier.

Moreover, according to the above-mentioned embodiment, the depth of thegate impurity region 20 just below the gate electrode 21 is controlledby vapor phase dispersion. This in turn controls the distance (d)between the gate impurity region 20 and the channel layer 14. Theadvantage of the controlled distance is that it is possible to increasethe built-in potential (φbi) between the semiconductor constituting thechannel layer 14 and the gate impurity region 20 just below the gate.This permits the semiconductor device to operate only with a singlepositive power supply.

Moreover, according to the above-mentioned embodiment, the semiconductordevice has the high-concentration impurity layer 17, between the channellayer 14 and the gate electrode 21 that is formed from a semiconductorhaving a broader bandgap than the semiconductor forming the channellayer 14. This reduces the dependence of the mutual conductance (Gm) andthe gate-source capacity (Cgs) on gate voltage (Vg). This in turncontributes to power-added efficiency.

Thus, the semiconductor device of the present invention exhibitsimproved controllability of threshold voltage (Vth) while maintainingthe mutual conductance characteristics.

A semiconductor device according to another embodiment of the presentinvention is shown in FIG. 3. It has the high-resistance layer 15 centirely covered with a p-type semiconductor region 25 of AlGaAs dopedwith a p-type impurity. The p-type semiconductor region 25 and thehigh-resistance layer 15 c are doped with a p-type impurity (say, Zn) byvapor phase dispersion at their part just below the gate electrode 21,so as to form the gate impurity region 20. The gate electrode 21connecting to the surface of the gate impurity region 20 is formed. Thesource electrode 22 a and the drain electrode 22 b are formed on thep-type semiconductor region 25, with the gate electrode 21 in between.The p-type semiconductor region 25 has an adequate thickness and anadequate impurity concentration so that depletion takes place in theregion between the source electrode 22 a and the gate electrode 21 andin the region between the drain electrode 22 b and the gate electrode21. The p-type semiconductor region is formed so thin that alloyingtakes place in its part just below the source electrode 22 a and thedrain electrode 22 b. Other parts than mentioned above are the same asthose in the semiconductor device shown in FIG. 1. Like referencecharacters are given to corresponding parts, without repeating theirexplanation. Incidentally, the source electrode 22 a and the drainelectrode 22 b may also be formed on the p-type semiconductor region 25with an n-type GaAs layer placed thereunder.

The p-type semiconductor region 25 is formed by epitaxial growth withdoping with a p-type impurity. Other layers and the electrodes areformed in the same way in the process explained in the previousembodiment.

The semiconductor device of the present invention shown in FIG. 3 isalso capable of operating with a single positive power supply and has areduced gate resistance. It also produces the same effect as thesemiconductor device shown in FIG. 1.

The present invention is not limited to the embodiments mentioned above.For example, the semiconductor device may be so modified as to have thesingle-heterostructure, with the buffer layer 12, high-resistance layer13 c, and carrier supply layer 13 a omitted.

The gate impurity region 20 is doped with a p-type impurity that can beeither zinc (Zn) or carbon (C).

The idea of the present invention its applicable to InP substrates aswell as GaAs substrates. In the case of InP substrate, the buffer layer12 on the substrate 11 is formed from undoped InP, the high-resistancelayers (13 b, 13 c, 15 b, 15 c) are formed from undoped Al_(x)In_(1-x)As(x=0.4 to 0.5), the channel layer 14 is formed from undopedIn_(x)Ga_(1-x)As (x=0.5 to 0.6), and the carrier supply layers (13 a, 15a) are formed from n-type In_(x)Ga_(1-x)As (x=0.4 to 0.5). The stopperlayer 16 forms on the high-resistance layer 13 c of In_(x)Ga_(1-x)As.The stopper layer 16 is from AlInAs that differs in the compositionalratio of In. The high-concentration gate impurity layer 17 forms on thestopper layer 16. The layer 17 is in an island-like shape from AlInAs orInP doped with a p-type impurity. Then, the gate impurity region 20 isformed by doping (vapor phase diffusion) with a p-type impurity (Zn orC). The gate electrode 21 of Ti/Pt/Au forms on the high-concentrationimpurity layer 17 of AlInAs in an island-like shape, through the openingin the insulating film 18, in the same way as mentioned above. Also, thesource electrode 22 a and drain electrode 22 b forms on the stopperlayer 16. The source electrode 22 a and drain electrode 22 b are layersobtained by heat treatment (for alloying) of the laminated film of AuGe,Ni, and Au, in the same as mentioned above.

Various changes and modifications may be made in the invention withoutdeparting from the spirit and scope thereof.

The semiconductor device according to the present invention is capableof operating with a single positive power supply and has a reduced gateresistance.

1. A process for producing a semiconductor device comprising; a step offorming a channel layer; a step of forming a first semiconductor layerover said channel layer; a step of forming a second semiconductor layercontaining an impurity of a first conduction type over said firstsemiconductor layer; a step of forming a masking layer having an openingwhich causes said second semiconductor layer to be partly exposed; astep of introducing a further impurity into said second and firstsemiconductor layers by using said masking layer as the mask; and a stepof forming a gate electrode over at least that part of said secondsemiconductor layer which is exposed in said opening wherein the step ofintroducing a further impurity into said second and first semiconductorlayers is accomplished by vapor phase diffusion or ion implantation. 2.The process for producing a semiconductor device as defined in claim 1,wherein the step of forming said second semiconductor layer isaccomplished by epitaxial growth which introduces said impurity of afirst conduction type.
 3. The process for producing a semiconductordevice as defined in claim 1, wherein said channel layer is formed fromlnGaAs and said first semiconductor layer is formed from AlGaAs.
 4. Theprocess for producing a semiconductor device according to claim 1,wherein the further impurity extends only partially into the firstsemiconductor layer.
 5. The process for producing a semiconductor deviceas defined in claim 1, wherein the impurity of a first conduction typeand the further impurity are of the same kind.
 6. The process forproducing a semiconductor device as defined in claim 5, wherein both theimpurity of a first conduction type and the further impurity contain Zn.7. A process for producing a semiconductor device comprising: a step offorming a channel layer; a step of forming a first semiconductor layerover said channel layer; a step of forming a second semicondutor layercontaining an impurity of a first conduction type over said firstsemiconductor layer; a step of forming a masking layer having an openingwhich causes said second semiconductor layer to be partly exposed; astep of introducing a further impurity into said second and firstsemiconductor layers by using said masking layer as the mask; and a stepof forming a gate electrode over at least that part of said secondsemiconductor layer which is exposed in said opening. further comprisinga step of forming a stopper layer which differs in etching selectiveratio from said second semiconductor layer, said step being carried outafter the step of forming said first semiconductor layer and before thestep of forming said second semiconductor layer, and said secondsemiconductor layer being formed on said stopper layer in the step offorming said second semiconductor layer.
 8. The process for producing asemiconductor device as defined in claim 7, wherein the step of formingsaid gate electrode is followed by a step of performing etching, byusing said gate electrode as the mask, on said masking layer and saidsecond semiconductor layer to such an extent that said stopper layer isexposed, while leaving unetched that part of said masking layer and saidsemiconductor layer which is under said gate electrode.
 9. The processfor producing a semiconductor device as defined in claim 8, furthercomprising the step of removing said masking layer and said secondsemiconductor layer by etching which is followed by a step of forming asource electrode and a drain electrode which are separated from eachother on said stopper layer with said gate electrode in between.